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Combined Manufacturing Process of Copper Electrodes for Micro Texturing Applications (AMSME)

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URI: http://hdl.handle.net/10498/25381

DOI: 10.3390/ma14102497

ISSN: 1996-1944

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2021_512.pdf (8.150Mb)
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Author/s
Sánchez, Carlos J.; Hernández, Pedro M.; Martínez, María D.; Marrero, María D.; Salguero Gómez, JorgeAuthority UCA
Date
2021-05
Department
Ingeniería Mecánica y Diseño Industrial
Source
Materials 2021, 14(10), 2497
Abstract
Surface texturing has brought significant improvements in the functional properties of parts and components. Sinker electro discharge machining (SEDM) is one of the processes which generates great texturing results at different scale. An electrode is needed to reproduce the geometry to be textured. Some geometries are difficult or impossible to achieve on an electrode using conventional and even unconventional machining methods. This work sets out the advances made in the manufacturing of copper electrodes for electro erosion by additive manufacturing, and their subsequent application to the functional texturing of Al-Cu UNS A92024-T3 alloy. A combined procedure of digital light processing (DLP) additive manufacturing, sputtering and micro-electroforming (AMSME), has been used to produce electrodes. Also, a specific laboratory equipment has been developed to reproduce details on a microscopic scale. Shells with outgoing spherical geometries pattern have been manufactured. AMSME process has shown ability to copper electrodes manufacturing. A highly detailed surface on a micrometric scale have been achieved. Copper shells with minimum thickness close to 300 mu m have been tested in sinker electro discharge machining (SEDM) and have been shown very good performance in surface finishing operations. The method has shown great potential for use in surfaces texturing.
Subjects
structured surfaces; texturing; micro-electroforming; additive manufacturing; sinker electro discharge machining
Collections
  • Artículos Científicos [11777]
  • Articulos Científicos Ing. Mec. [320]
Atribución 4.0 Internacional
This work is under a Creative Commons License Atribución 4.0 Internacional

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