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Three-dimensional chemical mapping using non-destructive SEM and photogrammetry

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URI: http://hdl.handle.net/10498/32942

DOI: 10.1038/s41598-018-29458-8

ISSN: 2045-2322

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OA_2018_007.pdf (2.107Mb)
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Author/s
Cervera Gontard, LionelAuthority UCA; Batista Ponce, MoisésAuthority UCA; Salguero Gómez, JorgeAuthority UCA; Calvino Gámez, José JuanAuthority UCA
Date
2018
Department
Ciencia de los Materiales e Ingeniería Metalúrgica y Química Inorgánica; Física de la Materia Condensada; Ingeniería Mecánica y Diseño Industrial
Source
Scientific Reports - 2018, Vol. 8 n. 1 pp. 1-10
Abstract
The slice and view approach in electron microscopy defines an ensemble of destructive techniques that is widely used for studying in 3D the structure and chemistry of samples with dimensions ranging from µm to mm. Here, a method is presented for measuring with high resolution and quantitatively the morphology and chemical composition of the surface of a sample in 3D. It is non-destructive and therefore, it is complementary to slice and view methods. The scheme is based on the fusion of conventional scanning electron microscopy (SEM) imaging, multi-view photogrammetry and compositional mapping using energy dispersive X-ray spectroscopy (EDXS). We demonstrate its potential by performing an accurate study of adhesion wear of a tungsten carbide tool that is difficult to obtain using conventional characterization techniques.
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  • Artículos Científicos [11595]
  • Articulos Científicos CC. Mat. [546]
  • Articulos Científicos Fis. Mat. Cond. [127]
  • Articulos Científicos Ing. Mec. [310]
Attribution 4.0 Internacional
This work is under a Creative Commons License Attribution 4.0 Internacional

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