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TEM study of defects versus growth orientations in heavily boron-doped diamond

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URI: http://hdl.handle.net/10498/30522

DOI: 10.1002/pssa.201532175

ISSN: 1862-6319

ISSN: 1862-6300

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Author/s
Lloret Vieira, Fernando ManuelAuthority UCA; Araújo Gay, DanielAuthority UCA; Alegre Salguero, María de la PazAuthority UCA; González Leal, Juan MaríaAuthority UCA; Villar Castro, María del PilarAuthority UCA; Eon, David; Bustarret, Etienne
Date
2015
Department
Física Aplicada; Ciencia de los Materiales e Ingeniería Metalúrgica y Química Inorgánica
Source
Physica Status Solidi (A) Applications and Materials Science, Vol. 212, Núm. 11, pp. 2468-2473
Abstract
Heavy boron-doping layer in diamond can be responsible for the generation of extended defects during the growth processes (Blank et al., Diam. Relat. Mater. 17, 1840 (2008)). As claimed recently (Alegre et al., Appl. Phys. Lett. 105, 173103 (2014)), boron pair interactions rather than strain-related misfit seems to be responsible for such dislocation generation. In the present work, electron microscopy observations are used to study the defects induced by heavy boron doping in different growth plane orientations. Facets of pyramidal Hillocks (PHs) and pits provide access to non-conventional growth orientations where boron atoms incorporation is different during growth. TEM analysis on FIB prepared lamellas confirm that also for those growth orientations, the generation of dislocations occurs within the heavily boron-doped diamond layers. Stacking faults (SFs) have been also observed by high resolution transmission electron microscopy (HREM). From the invisibility criteria, using weak beam (WB) observation, 1/2[110] and 1/6[112], Burgers vectors have been identified. Their generation behavior confirms the mechanism reported by Alegre et al. where local in-plane strain effects induced at the growing surface of the diamond lattice by the neighboring of several boron atoms cause the generation of such extended defects.
Subjects
boron; chemical vapor deposition; defects; diamond; dopoing; transmission electron microscopy
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